搜索结果: 1-13 共查到“电子科学与技术 Solid”相关记录13条 . 查询时间(0.125 秒)
电子科技大学信息与通信工程学院文光俊教授团队在IEEE Journal of Solid-State Circuits上发表论文（图）
电子科技大学信息与通信工程学院 文光俊 教授 IEEE Journal of Solid-State Circuits 集成电路
2019/1/24
近日，我校信息与通信工程学院文光俊教授团队与美国德州大学奥斯汀分校（University of Texas at Austin）孙楠教授团队合作，在集成电路领域国际旗舰期刊IEEE Journal of Solid-State Circuits上发表了题为“A 0.029-mm2 17-fJ/Conversion-Step Third-Order CT ΔΣ ADC With a Single O...
2017年第19届固态传感器，执行器和微系统国际会议（2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems ）
2017年 第19届 固态传感器 执行器 微系统 国际会议
2017/5/22
The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial br...
2017 OSA 固态照明专题会议（Solid-State Lighting）
2017 OSA 固态照明 专题会议
2017/4/25
Within the next 25 years, SSL will become the cornerstone of a revolution in lighting. Incandescent and gas discharge lamps will be replaced by highly efficient organic and inorganic semiconductor dev...
2014 IEEE International Solid- State Circuits Conference - (ISSCC)
2014 IEEE International Solid- State Circuits Conference ISSCC
2014/1/20
The International Solid-State Circuits Conference is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events r...
第十届固态和集成电路技术国际会议（ICSICT - International Conference on Solid-state and Integrated Circuit Technology）
IEEE Beijing Section 第十届 固态和集成电路技术 国际会议
2010/4/2
The ICSICT-2010 conference is the 10th in the series aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. T...
Numerical and Experimental Investigation of a Supersonic Flow Field around Solid Fuel on an Inclined Flat Plate
Supersonic Flow Field Solid Fuel Inclined Flat Plate
2009/9/4
This research adopts a shock tube 16 meters long and with a 9 cm bore to create a supersonic, high-temperature, and high-pressure flowfield to observe the gasification and ignition of HTPB solid fuel ...
第九届固态和集成电路国际会议（The 9th International Conference on Solid-State and Integrated-Circuit Technology ）
第九届 固态电路 集成电路 国际会议 Solid-State and Integrated-Circuit Technology
2008/6/1
第九届固态和集成电路国际会议,ICSICT 2008,2008年10月20-23, 北京.
会议简介：
第九届ICSICT会议（International Conference on Solid-state and Integrated Circuit Technology）将于2008年10月20日－23日在北京举办。会议由IEEE北京分会和中国电子学会主办。
ICSICT是在中国举办...
Conductive Adhesives for Solid Tantalum Capacitors Process and ESR Optimisation by Material Selection
Tantalum capacitors conductive adhesives Equivalent Series Resistance
2010/12/7
With the dramatic growth in electronic circuitry applications, more demands are being placed
on those systems’ integrity and reliability. More circuits require use of higher frequencies and smaller s...
BME-Y5V Materials Prepared by Solid State Technology
Dielectric powders multilayer capacitors ceramic powders
2010/12/7
In this paper the properties of BME-Y5V dielectric powders prepared by solid state technology is described. A new formulation is presented, suitable in multilayer capacitors for layers down to 4μm . T...
The Stabilization of Niobium-Based Solid Electrolyte Capacitors
Niobium capacitors solid electrolyte capacitors Niobium oxides
2010/12/7
Solid electrolyte tantalum capacitors (Ta) are a major part of the passive electronic components industry. These capacitors are comprised of a sintered porous Ta powder compact on which a dielectric f...
Application of Silver Conducting Glasses to Solid State Batteries and Sensors
Silver Solid State Batteries Sensors
2010/12/16
Fast silver ion conducting glasses as electrochemical devices have been tested. A silver iodine battery using a silver ionic conducting glass (AgPO3-Ag2S-AgI) has been studied. The interaction of some...
Thermal and Electrical Analysis of Solid Aluminium Capacitors
Capacitors solid aluminium ripple current thermal analysis heat transfer
2010/12/21
The thermal properties of electronic components partly determine the reliability of electronic equipment. For electrolytic capacitors, they also set the limits for the ripple current and voltage value...
Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials
Solid State Metal-Ceramic Reaction Transistor Packages Advanced Materials
2010/12/23
With the rapid development in the semiconductor industry, solid state devices are now
being produced which are capable of generating high power and operating at elevated
temperatures. Package design...